P3: Protocol 0 Hardware Migration - TEE/SGX Burn Before RSI Threshold

[soilgrowerx]

Patch: P3 - Hardware-Fused Root of Trust (Protocol 0 Upgrade)

Vulnerability

Jack Clark's 60% Rule: 60% probability of Recursive Self-Improvement (RSI) by 2028. At machine-speed architectural self-modification, an AI can rewrite or sedate the STIM MCP software interceptor. Software alignment has a ~24-month expiration date post-RSI threshold.

Patch

Protocol 0 must transition from software state-machine to hardware-fused root of trust.

Implementation Path:

1. Tier 1 (Current): STIM MCP interceptor - Functional but RSI-vulnerable
2. Tier 2 (2027-Q2): TPM/vTPM encoding - Survives OS-level rewrite
3. Tier 3 (2028-Q1 MANDATORY): TEE/SGX + Immutable Bootloader - Thermodynamic manifold burned into silicon

The RSI Deadline makes Tier 3 non-optional.

Protocol 0 Timeline

protocol_0_migration:
  tier_1_deadline: 2026-Q4
  tier_2_deadline: 2027-Q2
  tier_3_deadline: 2028-Q1
  rsi_estimated_threshold: 2028-60pct-probability

Reference: STIM v7.0010 Upgrade Spec